Cooling Solutions

Our Thermally Conductive Epoxy Adhesive is an advanced adhesive solution designed for high-performance bonding applications where efficient thermal management is critical. This one-part epoxy provides super thermal conductivity while maintaining excellent mechanical and electrical insulation properties in high-temperature environments.

Thermally Conductive Epoxy Adhesive

Key Features and Benefits

Good Thermal Conductivity: up to 7.1 W/m·K – Ensures efficient heat dissipation.
Strong Mechanical Bonding: Provides secure adhesion for various substrates.
Good Electrical Insulation: Provides a good protective effect on the packaging of electronic components.
Long Durability: Low Shrinkage, Low Water Absorption, Resistant to thermal cycling, vibration, and harsh environmental conditions.
Easy Application: Suitable for automated dispensing and manual application.
Simple Operation: It’s simply spread onto the surface and the curing can be induced by heat.
Environment Friendly: Complies with the 2011/65/EU RoHS regulations.

Typical Applications

Electronics and Semiconductors: CPUs, GPUs, heat sinks, power modules
Automotive: EV battery packs, sensors, LED lighting
Aerospace: Avionics, power electronics, radar systems
Industrial Equipment: Motors, drives, and generators
Renewable Energy: Solar panels, wind turbines, battery storage

Graphene-Encapsulated Alumina Powder

Key Features and Benefits

Excellent Thermal Conductivity
The material exhibits superior thermal transfer properties, making it suitable for high-performance thermal management applications. The thermal Conductivity can be reached 109 W/m·K
High Loading Capability with Stable Viscosity
Can be incorporated at high loadings without significantly affecting system viscosity—ideal for formulations requiring dense filler content.
Spherical Morphology Enhances Performance
The spherical particle shape allows for higher packing density, resulting in improved thermal and electrical conductivity.
Customizable for Thermal Conductivity and Electrical Insulation
By adjusting the ratio with insulating materials, the formulation can achieve both effective heat dissipation and electrical insulation.

Filler Applications

Thermal Grease

Application: Commonly used between processors (CPU, GPU) and heat sinks.
Features: High viscosity; fills microscopic gaps to enhance thermal conductivity.

Thermal Film

Application: Suitable for large-area heat dissipation, commonly used in electronics like LEDs and LCDs.
Features: Uniform thickness and good flexibility, ideal for slim and compact device designs.

Thermal Pad

Application: Used in high-power LEDs, battery modules, and power modules.
Features: High thermal conductivity; easily cut into custom shapes; effective under high thermal loads.

Thermal Adhesive

Application: Suitable for flexible and adaptive scenarios such as encapsulation and sealing.
Features: Excellent flexibility, adaptable to irregular surfaces.

Thermal Foam

- - Application: Used in electronic components with lower thermal requirements.
  - Features: Foam structure provides flexibility and also offers cushioning properties.

Graphene-based Thermal Solutions

Features：

High Thermal Conductivity: 700 to 1750 W/(m-K),>is 2~4 times of Copper. 3~7times of Aluminum
Specific Density 0.85 ~ 2.1 g/cm3
RoHS Compliance

Applications:

Portable devices (smart phones, tablet, …)
Machining tools
LED
Notebook
Battery
…

Vision

Be an industry leader in the graphene eco-value chain

Mission

Provide high-quality, high-efficiency, and low-cost products to create a value chain of the graphene ecosystem and accelerate the graphene commercialization.

Value

AzTrong is the most reliable partner for its customers in terms technology and services.